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TUF Gaming Alliance Certified. Asymmetric cutting design heat spreader. High quality aluminum forged heat spreader all-covered. 1.2V~1.35V ultra low working voltage. Support Intel XMP 2.0 smart overclocking technology. Selected high quality IC chips. Certified memory by TUF Gaming Alliance. TEAMGROUP T-FORCE once again joins forces with motherboard leader ASUS and releases the overclocked gaming memory T-FORCE VULCAN TUF Gaming Alliance. It is certified and strictly tested by TUF Gaming Alliance. The appearance is designed with unique military camouflage pattern. With clock frequency of up to 3600MHz, it offers consumers an experience in high-speed performance and a hardware with unique style. T-FORCE VULCAN TUF Gaming Alliance overclocked gaming memory is definitely your best comrade when you are on the battlefield of gaming or pushing the limits of overclocking.. TUF military pattern design. With creativity and ingenuity, TEAMGROUP design team adds TUF’s unique military camouflage pattern and asymmetrical cutting on the heat spreader. The creatively built T-FORCE VULCAN TUF GAMING ALLIANCE is perfect for gamers who love military pattern style.. Complete coverage of the heat spreader, improve radiating performance. The heat spreader area of T-FORCE VULCAN TUF Gaming Alliance is extended to the top and the two sides to provide memory a complete coverage of protection and enhance the radiating performance, so the system is able to maintain a long time stable operation.. Ultra low working voltage, Save energy up to 40% Supports XMP 2.0. Features. Cooling type. Heatsink. Product colour. Red. AMD Extended Profiles for Overclocking (EXPO). Yes. Intel Extreme Memory Profile (XMP) version. 3.0. Intel Extreme Memory Profile (XMP). Yes. Memory voltage. 1.35 V. Memory data transfer rate. 28800 MT/s. CAS latency. 38. On-Die ECC. Yes. ECC. Yes. Component for. PC. Memory clock speed. 3600 MHz. Internal memory type. DDR4. Memory layout (modules x size). 2 x 8 GB. Internal memory. 16 GB. General. Product family. VULCAN. Weight & dimensions. Height. 7.5 mm. Depth. 32.7 mm. Width. 140 mm
Price: £29.99 from Back to the Office
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| Back to the Office | £29.99 | Go to shop |
Simple design to perfectly protect the cooling module. High thermal conductive adhesive. Supports Intel & AMD motherboards. Selected high-quality IC. Supports XMP2.0. Energy saving with ultra-low working voltage. Reinforced structure and enhanced heat...
Simple design to perfectly protect the cooling module. High thermal conductive adhesive. Supports Intel & AMD motherboards. Selected high-quality IC. Supports XMP2.0. Energy saving with ultra-low working voltage. Reinforced structure and enhanced heat...
Reinforced structure and enhanced heat dissipation Designed for complete protection and enhanced heat dissipation, the heat spreader is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition,...
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