Netac Basic DDR4-3200 8G C16

Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals. Low-power auto self refresh (LPASR). Data bus inversion (DBI) for data bus. On-die VREFDQ generation and calibration. On-board I2C serial presence-detect (SPD) EEPROM. Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS). Selectable BC4 or BL8 on-the-fly (OTF). Databus write cyclic redundancy check (CRC). Temperature controlled refresh (TCR). Command/Address (CA) parity. Per DRAM Addressability is supported. 8 bit pre-fetch. Fly-by topology. Command/Address latency (CAL). Terminated control command and address bus. PCB: Height 1.23” (31.25mm). Gold edge contacts. RoHS Compliant and Halogen-Fre. Netac Basic DDR4. Original chips improve the performance of computer. Selected original chips, strict inspection process, 8-layer PCB board, stable performance. Excellent compatibility. Memory products have passed the motherboard compatibility test of mainstream brands on the market, ensure the stability of the system for along time. Gold-plated craft gold finger. Gold plating process, stronger conductivity and corrosion resistance. Features. Lead plating. Gold. SPD profile. Yes. Programming power voltage (VPP). 2.5 V. Intel Extreme Memory Profile (XMP). Yes. Memory voltage. 1.35 V. Memory channels. Single-channel. CAS latency. 16. ECC. No. Memory form factor. 288-pin DIMM. Component for. PC/Server. Memory clock speed. 3200 MHz. Internal memory type. DDR4. Memory layout (modules x size). 1 x 8 GB. Internal memory. 8 GB. Buffered memory type. Unregistered (unbuffered). Operational conditions. Storage temperature (T-T). -55 - 100 °C. Operating temperature (T-T). 0 - 85 °C. Technical details. Compliance certificates. RoHS. Sustainability. Doesn't contain. Halogen. Weight & dimensions. Height. 31.2 mm. Width. 133.3 mm. leaflet

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