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A 5G NR/LTE-FDD/LTE-TDD/UMTS/HSPA+ wireless communication module with receive. diversity. Supports embedded operating systems such as Windows, Linux and Android. Provides GNSS function and optional eSIM function. PCI Express M.2 Interface. ThinkPad Quectel RM520N-GL 5G M.2 WWAN Module for X1 2-in-1 Gen 9/T16 Gen 3 is a 5G NR/LTE-FDD/LTE-TDD/UMTS/HSPA+ wireless communication module with receive diversity. It provides data connectivity on 5G NR SA and NSA, LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks. RM520N-GL is a standard M.2 Key-B WWAN module.. Ports & interfaces. Interface. WWAN. Host interface. M.2. Connectivity technology. Wireless. Network. Mobile network generation. 5G. Design. Compatible products. X1 2-in-1 Gen 9/T16 Gen 3. Certification. ISO/ IEC 7816-3, and MIPI. Antenna design. Internal. Component for. Laptop. Internal. Yes. Operational conditions. Operating relative humidity (H-H). 5 - 95%. Operating temperature (T-T). -30 - 75 °C. Weight & dimensions. Weight. 8.7 g. Height. 2.3 mm. Depth. 30 mm. Width. 52 mm. Packaging data. Package weight. 30 g. Package height. 177 mm. Package depth. 144 mm. Package width. 53 mm
Price: £192.99 from Back to the Office
| Retailer | Price | |
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| Back to the Office | £192.99 | Go to shop |
Fibocom FM350-GL. Embedded eSIM. 5G Sub-6 GHz WWAN module. Dimension: 30 x 52 x 2.3 mm / 1.18 x 2.04 x 0.09 inches. Interface: M.2 Key-B. ThinkPad Fibocom FM350-GL 5G Sub-6 GHz M.2 WWAN Module for X1 Yoga Gen 8 is a wireless communication module with...
Fibocom FM350-GL. Embedded eSIM. 5G Sub-6 GHz WWAN module. Dimension: 30 x 52 x 2.3 mm / 1.18 x 2.04 x 0.09 inches. Interface: M.2 Key-B. ThinkPad Fibocom FM350-GL 5G Sub-6 GHz M.2 WWAN Module for X1 Carbon Gen 11 is a wireless communication module with...
A 5G NR/LTE-FDD/LTE-TDD/UMTS/HSPA+ wireless communication module with receive. diversity. Supports embedded operating systems, such as Windows, Linux and Android. Provides GNSS function and optional eSIM function. PCI Express M.2 Interface. Compliant...
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