Cooler Master CryoFuze heat sink compound Thermal paste 14 W/m·K 2 g

High Performance. Exceptional Thermal Conductivity. Anhygroscopic. (non moisture absorbent). Easy Application. Non Corrosive Formula. Close Cold Contact. Thermal Grease CryoFuze. Cooler Master is launching CryoFuze, the all new line of thermal paste delivering superior bonding for your processing capabilities.. High Performance. Utilizing nanoparticles, CryoFuze allows for excellent thermal conductivity on all processing components for optimal heat transfer.. Exceptional Thermal. K value of 14W/mK handles even the most extreme system builds.. Non Corrosive Formula. The non corrosive and oxidation resistant properties prevent solidification and leaves metal contact surfaces unharmed. CryoFuze has a versatile range of temperature performance, maintaining stability from -50°C up to 250°C.. Easy Application. Viscously balanced formula allow for easy application and clean up.. Features. Operating temperature (T-T). -50 - 250 °C. Specific gravity. 2.6 g/cm³. Product colour. Grey. Thermal conductivity. 14 W/m·K. Type. Thermal paste. Weight & dimensions. Weight. 2 g. Volume. 0.7 ml. Packaging data. Package weight. 35 g. Package height. 33 mm. Package depth. 163 mm. Package width. 113 mm. Quantity per pack. 1 pc(s). Logistics data. Products per master (outer) case. 40 pc(s). Master (outer) case height. 256 mm. Master (outer) case length. 360 mm. Master (outer) case width. 345 mm. leafletCryoFuze - Tutorial Video

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